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XTM-640: High resolution uncooled thermal infrared module

Ready-to-integrate thermal infrared module consuming ultra-low power.

The XTM-640 infrared camera module is equipped with an uncooled microbolometer array (640 x 480 pixel) and offers a pixel pitch of 17 µm for the detection of thermal infrared radiation between 8 and 14 µm.

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XTM-640: High resolution uncooled thermal infrared module

Key features

  • Uncooled microbolometer
  • 640 x 480 pixels
  • 8 to 14 µm bandwidth
  • 50 Hz framerate
  • Samtec 40 pin QTE interface
  • 32 x 45 x 45 mm³

XTM-640: High resolution uncooled thermal infrared module

Xenics' XTM-640 thermal module is an extremely compact and versatile thermal camera module with unique image quality and stability for a broad range of OEM applications. These applications include security, night vision, firefighting, airborne and land-based reconnaissance and surveillance.

We guarantee you unparalleled uniform and crisp thermal images thanks to our XTM's powerful readout and processing electronics.

You can easily integrate our XTM-640 into your system with the universal QTE connector. This allows you immediate connection, data acquisition, command and control.

Key Benefits

Accessories

 - Made in Europe

 - High resolution

 - Easy connectivity

 - Small 17 µm pixel pitch

 - Cables

Related products

XSW-640

High resolution cooled SWIR module

XSW-640 high resolution cooled SWIR infrared module

 

XTM-640: Detailed specifications (preliminary)

 Array Specifications

XTM-640

 Array type

 Uncooled microbolometer (a-Si)

 Spectral band

 8.0 to 14.0 µm

 # Pixels

 640 x 480

 Pixel pitch

 17 µm

 NETD ≈ 50 mK @ 30°C with f/1 lens

 Pixel operability

 > 99,9%

Camera  Specifications

  XTM-640

 Lens (Included)

 Optical interface

 Multiple lens mounts

 Imaging Performance

 Frame rate

 50 Hz
 Shutter Yes
 A to D conversion resolution  16 bit

 Interfaces

 Connector type

 Samtec 40 pin QTE

 Digital output

Digital output following BT.601-6/BT.656-5 standard

Parallel uncompressed video data

 Digital control

Serial LVCMOS 3 V interface using XSP protocol
 Trigger In and out
 GPIO Extended GPIO via I2C

 Power Requirements

 Power consumption

2.0 W

 Power supply

3.3 V

 Physical Characteristics

 Shock 70 G, 2 ms halfsine profile (without shutter)

 Vibration

4.5 G (5 Hz to 500 Hz)

 Ambient operating temperature

0°C to 50°C

 Dimensions

32 x 45 x 45 mm³
 Weight module 100 g 

XTM-640: Applications

The XTM-640 is a ready-to-integrate thermal infrared module which requires ultra-low powering. This makes the XSW-640 thernal module appropriate for use in following applications:

Media Library

Application Examples

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XTM-640: Documentation

All additional information about our XTM-640 high resolution uncooled thermal infrared module can be found within the following documentation:

Brochures

More information is available on request.

Press Releases

XenicsCores

 

Where to buy?

More information on where to buy our XenicsCores.