Hyperspectral Imaging is the answer to the growing need of capturing the finest possible differences in materials. Manufacturers are developing and constantly improving hardware and software components for this purpose. However, high costs and technical aspects limit the use of this technology in some applications....


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Thermal imaging can be a very powerful tool for semiconductor failure analysis. Current leakage defects typically generate thermal hot-spots: metal short circuits, latch-up, junction defects in diodes and transistors, breakdown of MOS gate oxide, ESD failures, etc. When using conventional thermography or thermal imaging on...


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