Leuven, Belgium / Orlando, FL, 24.04.2011 — Xenics, Europe’s leading developer and manufacturer of advanced infrared detector solutions, will introduce at SPIE DSS 2011 a new family “XenicsCores” of high resolution infrared OEM-modules which offer easy integration and high image quality. They support sophisticated OEM applications such as: Night vision, border security, search & rescue (SAR), medical diagnostic equipment, machine vision and non destructive testing. Xenics exhibits in Palms Hall, Booth # 3119.
Xenics has chosen SPIE DSS 2011 for the presentation of a new product family “XenicsCores”. The XTM and XSW are compact uncooled OEM modules, which are ready to be integrated in the customer’s application. They are light-weight, low-power consuming and easy-to-integrate via its universal QTE connector.
The XSW-640 or Xenics Short Wave module is optimised for the detection of shortwave infrared radiation (SWIR) between 0.9 and 1.7 μm. It is based on an uncooled InGaAs array of 640 by 512 pixels with 20 μm pixel pitch and measures only 45 x 45 x 20 mm³.
The XTM-640 or Xenics Thermal Module is optimised for the detection of thermal infrared radiation between 8 and 14 μm. It is equipped with an uncooled microbolometer array of 640 by 480 pixels with 17 μm pixel pitch with high thermal sensitivity of 50 mK. It measures only 45 x 45 x 32 mm³, including advanced shutter design for optimal image performance in a small form factor housing.
Both modules weigh only 100 grams and consume less than 2.0 W power from a 3.3 V power supply. Their outputs deliver full digital data at 50Hz, in 16 bit resolution for the XTM and in 14 bit resolution for the XSW. Using the XSP protocol, data is transferred over the QTE connector for immediate conversion to analog output signals in PAL or NTSC format. Trigger input and output are available for synchronisation with external sources. Via its powerful readout and processing electronics, advanced NUC and image processing algorithms guarantee unparalleled uniform and crisp thermal images over a wide range of dynamic environments. The optomechanical design of the XenicsCores is adapted to accommodate customer specific lens and interface requirements.
Bob Grietens, CEO and founder of Xenics, comments on the new offer for OEMs: “With the introduction of the XenicsCores XTM and XSW, Xenics has taken the strategic decision to extend its product portfolio with OEM modules, offering system integrators a new level of high performance modules for their demanding applications. The introduction of the XenicsCores will further ensure our continuous growth by moving into new high volume markets that require modules that are easy to use, yet keeping the high level of image quality under a wide variety of dynamic environments.”
The modules also serve in-house as a platform for new packaged systems from Xenics such as the Pumair-170DW (a unique dual wavelength airborne system in compact and lightweight housing) and Gobi-640-GigE, an uncooled “smart thermal” camera with high resolution of 640 x 480 pixel and a GigE Vision interface.
